The BondMachine project Iron Award at the InnovateFPGA grand final

The BondMachine project won the Iron Award at the InnovateFPGA 2018 grand final at Intel Campus in San Jose (CA) USA on 15th of August 2018. It has been a pleasure and an honor to be there. I collected some photos of our adventure in San Francisco.

• Golang
• Bondmachine
• Projects
• Fpga
• Computer Architecture
• Reconfigurable Computing
• Innovatefpga
• Contest
• Terasic
• Intel